Etch and rinse versus self-etching adhesives systems: Tridimensional micromechanical analysis of dentin/adhesive interface
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Data
2012-06-01
Autores
Junior, Manoel M.
Rocha, Eduardo Passos [UNESP]
Anchieta, Rodolfo B. [UNESP]
Archangelo, Carlos Marcelo
Luersen, Marco Antonio
Título da Revista
ISSN da Revista
Título de Volume
Editor
Elsevier B.V.
Resumo
The purpose of this study was to evaluate stress distribution in the hybrid layer produced by two adhesive systems using three-dimensional finite element analysis (FEA). Four FEA models (M) were developed: Mc, a representation of a dentin specimen (41 x 41 x 82 mu m) restored with composite resin, exhibiting the adhesive layer, hybrid layer (HL), resin tags, peritubular dentin, and intertubular dentin to simulate the etch-and-rinse adhesive system; Mr, similar to Mc, with lateral branches of the adhesive; Ma, similar to Mc, however without resin tags and obliterated tubule orifice, to simulate the environment for the self-etching adhesive system; Mat, similar to Ma, with tags. A numerical simulation was performed to obtain the maximum principal stress (sigma(max)). The highest sigma(max) in the HL was observed for the etch-and-rinse adhesive system. The lateral branches increased the sigma(max) in the HL. The resin tags had a little influence on stress distribution with the self-etching system. (C) 2012 Elsevier Ltd. All rights reserved.
Descrição
Palavras-chave
Finite element stress analysis, Mechanical properties of adhesives, Dentin bonding agents, Hybrid layer, Etch-and-rinse adhesives, Self-etch adhesives
Como citar
International Journal of Adhesion and Adhesives. Oxford: Elsevier B.V., v. 35, p. 114-119, 2012.