Evaluating the residual stress in PbTiO3 thin films prepared by a polymeric chemical method
Nenhuma Miniatura disponível
Data
2004-03-07
Autores
Valim, D.
Souza, A. G.
Freire, PTC
Mendes, J.
Guarany, C. A.
Reis, R. N.
Araujo, E. B.
Título da Revista
ISSN da Revista
Título de Volume
Editor
Iop Publishing Ltd
Resumo
We report a study of residual stress in PbTiO3 (PT) thin films prepared on Si substrates by a polymeric chemical method. The E(1TO) frequency was used to evaluate the residual stress through an empirical equation available for bulk PT. We find that the residual stress in PT films increases as the film thickness decreases and conclude that it originates essentially from the contributions of extrinsic and intrinsic factors. Polarized Raman experiments showed that the PT films prepared by a polymeric chemical method are somewhat a-domain (polar axis c parallel to the substrate) oriented.
Descrição
Palavras-chave
Como citar
Journal of Physics D-applied Physics. Bristol: Iop Publishing Ltd, v. 37, n. 5, p. 744-747, 2004.