Effect of combined bending strain and thermal cycling on the voltage-current characteristic curves of Bi-2223 tapes

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dc.contributor.authorShigue, C. Y.
dc.contributor.authorBaldan, C. A.
dc.contributor.authorOliveira, U. R.
dc.contributor.authorCarvalho, FJH
dc.contributor.authorFilho, E. R.
dc.contributor.institutionUniversidade de São Paulo (USP)
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)
dc.date.accessioned2014-05-20T15:22:50Z
dc.date.available2014-05-20T15:22:50Z
dc.date.issued2005-06-01
dc.description.abstractHigh critical temperature superconductors are evolving from a scientific research subject into large-scale application devices. In order to meet this development demand they must withstand high current capacity under mechanical loads arising from thermal contraction during cooling from room temperature down to operating temperature (usually 77 K) and due to the electromagnetic forces generated by the current and the induced magnetic field. Among the HTS materials, the Bi2Sr2Ca2Cu3Ox, compound imbedded in an Ag/AgMg sheath has shown the best results in terms of critical current at 77 K and tolerance against mechanical strain. Aiming to evaluate the influence of thermal stress induced by a number of thermal shock cycles we have evaluated the V-I characteristic curves of samples mounted onto semicircular holders with different curvature radius (9.75 to 44.5 mm). The most deformed sample (epsilon = 1.08%) showed the largest reduction of critical current (40%) compared to the undeformed sample and the highest sensitivity to thermal stress (I-c/I-c0 = 0.5). The V-I characteristic curves were also fitted by a potential curve displaying n-exponents varying from 20 down to 10 between the initial and last thermal shock cycle.en
dc.description.affiliationFAENQUIL, DEMAR, Dept Mat Engn, Fac Engn Quim Lorena, BR-12607970 Lorena, SP, Brazil
dc.description.affiliationUNESP, FEG, Fac Engn Guaratingueta, Guaratingueta, SP, Brazil
dc.description.affiliationUNICAMP, Fac Elect & Comp Engn, Campinas, SP, Brazil
dc.description.affiliationUnespUNESP, FEG, Fac Engn Guaratingueta, Guaratingueta, SP, Brazil
dc.format.extent2492-2494
dc.identifierhttp://dx.doi.org/10.1109/TASC.2005.847497
dc.identifier.citationIEEE Transactions on Applied Superconductivity. Piscataway: IEEE-Inst Electrical Electronics Engineers Inc., v. 15, n. 2, p. 2492-2494, 2005.
dc.identifier.doi10.1109/TASC.2005.847497
dc.identifier.issn1051-8223
dc.identifier.urihttp://hdl.handle.net/11449/33746
dc.identifier.wosWOS:000229767200015
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartofIEEE Transactions on Applied Superconductivity
dc.relation.ispartofjcr1.288
dc.relation.ispartofsjr0,408
dc.rights.accessRightsAcesso restrito
dc.sourceWeb of Science
dc.subjectbending strainpt
dc.subjectBi-2223 tapespt
dc.subjectcritical currentpt
dc.subjectdegradationpt
dc.subjectthermal shockpt
dc.titleEffect of combined bending strain and thermal cycling on the voltage-current characteristic curves of Bi-2223 tapesen
dc.typeArtigo
dcterms.licensehttp://www.ieee.org/publications_standards/publications/rights/rights_policies.html
dcterms.rightsHolderIEEE-Inst Electrical Electronics Engineers Inc

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