Relationships between the curing conditions and some mechanical properties of hybrid thermosetting materials

dc.contributor.authorDias Filho, Newton L. [UNESP]
dc.contributor.authorCardosob, Celso X. [UNESP]
dc.contributor.authorDe Aquino, Hermes A. [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-27T11:22:00Z
dc.date.available2014-05-27T11:22:00Z
dc.date.issued2006-10-16
dc.description.abstractThe relationship between the heat of polymerization (ΔH) and activation energy (Ea) parameters, obtained by differential scanning calorimetry (DSC) and the ratio of epoxy resin to hardener of the thermosetting materials based on an organic-inorganic hybrid epoxy resin (OG) was investigated. Activation energy (Ea) and heat of polymerization (ΔH) increased with an increasing OG content, up to 70 wt%. Further increase in OG content to 80wt% reduced Ea and ΔH. Dynamic mechanical analysis indicates that the maximum cross-link density is obtained at 83 wt% OG, whereas fracture toughness and tensile modulus mechanical properties are maximized at 70 wt% OG. ©2006 Sociedade Brasileira de Química.en
dc.description.affiliationDepartamento de Física e Química Universidade Estadual Paulista, Av. Brasil, 56, Centro, 15385-000 Ilha Solteira- SP
dc.description.affiliationDepartamento de Física, Química e Biologia Universidade Estadual Paulista, Rua Roberto Simonsen, 305, 19060-900 Presidente Prudente-SP
dc.description.affiliationUnespDepartamento de Física e Química Universidade Estadual Paulista, Av. Brasil, 56, Centro, 15385-000 Ilha Solteira- SP
dc.description.affiliationUnespDepartamento de Física, Química e Biologia Universidade Estadual Paulista, Rua Roberto Simonsen, 305, 19060-900 Presidente Prudente-SP
dc.format.extent935-943
dc.identifierhttp://dx.doi.org/10.1590/S0103-50532006000500018
dc.identifier.citationJournal of the Brazilian Chemical Society, v. 17, n. 5, p. 935-943, 2006.
dc.identifier.doi10.1590/S0103-50532006000500018
dc.identifier.file2-s2.0-33749556059.pdf
dc.identifier.issn0103-5053
dc.identifier.scieloS0103-50532006000500018
dc.identifier.scopus2-s2.0-33749556059
dc.identifier.urihttp://hdl.handle.net/11449/69173
dc.identifier.wosWOS:000240351200018
dc.language.isoeng
dc.relation.ispartofJournal of the Brazilian Chemical Society
dc.relation.ispartofjcr1.444
dc.relation.ispartofsjr0,357
dc.rights.accessRightsAcesso aberto
dc.sourceScopus
dc.subjectDifferential scanning calorimetry
dc.subjectEpoxy resin
dc.subjectNanocomposites
dc.subjectSiloxane
dc.subjectSilsesquioxanes
dc.titleRelationships between the curing conditions and some mechanical properties of hybrid thermosetting materialsen
dc.typeArtigo
dcterms.licensehttp://www.scielo.br/revistas/jbchs/iaboutj.htm
unesp.campusUniversidade Estadual Paulista (Unesp), Faculdade de Ciências e Tecnologia, Presidente Prudentept
unesp.campusUniversidade Estadual Paulista (Unesp), Faculdade de Engenharia, Ilha Solteirapt

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