Physiological and sanitary quality of sorghum seeds under the effect of oxalic and salicylic acid
Carregando...
Arquivos
Fontes externas
Fontes externas
Data
Orientador
Coorientador
Pós-graduação
Curso de graduação
Título da Revista
ISSN da Revista
Título de Volume
Editor
Tipo
Artigo
Direito de acesso
Arquivos
Fontes externas
Fontes externas
Resumo
Sorghum is one of the world’s most important cereal crops, but it is susceptible to several diseases, particularly fungal diseases, with seeds being the main vehicle for dissemination. The objective of this study was to evaluate the effects of salicylic acid (SA) and oxalic acid (OA) on the physiological and sanitary quality of sorghum seeds. The seeds of Sorghum bicolor (L.) were immersed for 1 hour in solutions of OA (0.5, 1.0, 1.5, and 2.0 mM) and SA (0.5, 1.0, 1.5, and 2.0 mM). A treatment with Captan® fungicide was also used, and the control group was immersed in distilled H2O for 1 hour. Variables from seed vigor tests and fungal incidence tests were evaluated. The control group showed the highest germination rate. However, among the treatments, the doses of 1 mM OA and 0.5 mM SA resulted in higher germination in the first germination count. The application of 1 mM OA and both doses of SA (0.5 mM and 1 mM) promoted a greater seedling vigor index (GVI). Seeds treated with 1 mM OA and doses of 0.5, 1, 1.5, and 2.0 mM SA, as well as those treated with fungicide, had the highest emergence rates, and with 1.5 mM SA, the highest length of the longest root (LVEI). Seedlings from seeds treated with 0.5, 1, and 1.5 mM SA and with 0.5 and 1.5 mM had the highest coleoptile length (CPA). The 0.5 mM dose of SA reduced the incidence of Aspergillus flavus, and the doses of 2 mM OA and 1, 1.5, and 2 mM SA reduced the incidence of Rhizopus stolonifer to 0%. SA provided the best physiological and health effects for sorghum seeds, making it the best treatment.
Descrição
Palavras-chave
endophytic fungi, resistance induction, seeds
Idioma
Inglês
Citação
Australian Journal of Crop Science, v. 18, n. 7, p. 382-387, 2024.




