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Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films

dc.contributor.authorFraga, M. A.
dc.contributor.authorMassi, M.
dc.contributor.authorOliveira, I. C.
dc.contributor.authorCruz, Nilson Cristino da [UNESP]
dc.contributor.authorSantos Filho, S. G. dos
dc.contributor.institutionInstituto Tecnológico de Aeronáutica (ITA)
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionUniversidade de São Paulo (USP)
dc.date.accessioned2014-05-20T15:32:14Z
dc.date.available2014-05-20T15:32:14Z
dc.date.issued2009-01-01
dc.description.abstractAmorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films.en
dc.description.affiliationPlasmas and Processes Laboratory Technological Institute of Aeronautics
dc.description.affiliationPlasma Laboratory UNESP, Sorocaba
dc.description.affiliationUniversity of São Paulo LSI EPUSP, São Paulo
dc.description.affiliationUnespUNESP, Departamento de Engenharia de Controle e Automação, Plasma Lab, Sorocaba, Brazil
dc.format.extent327-330
dc.identifierhttp://www.scientific.net/MSF.615-617.327
dc.identifier.citationMaterials Science Forum, v. 615 617, p. 327-330.
dc.identifier.dimensionspub.1072130245
dc.identifier.doi10.4028/www.scientific.net/MSF.615-617.327
dc.identifier.issn0255-5476
dc.identifier.issn1662-9752
dc.identifier.lattes7157327220048138
dc.identifier.orcid0000-0002-7117-8039
dc.identifier.orcid0000-0001-6976-8550
dc.identifier.orcid0000-0002-0324-5703
dc.identifier.scopus2-s2.0-79251649240
dc.identifier.urihttp://hdl.handle.net/11449/130388
dc.identifier.wosWOS:000265961100078
dc.language.isoeng
dc.publisherTrans Tech Publications Ltd
dc.publisherTrans Tech Publications
dc.relation.ispartofMaterials Science Forum
dc.relation.ispartofsjr0,180
dc.rights.accessRightsAcesso abertopt
dc.sourceScopus
dc.sourceDimensions
dc.subjectSilicon carbon nitrideen
dc.subjectThermal annealingen
dc.subjectResistivityen
dc.subjectElastic modulusen
dc.subjectHardnessen
dc.titleElectrical and Mechanical Properties of Post-annealed SiC(x)N(y) Filmsen
dc.typeTrabalho apresentado em eventopt
dcterms.licensehttp://www.ttp.net/Downloads.html
dcterms.rightsHolderTrans Tech Publications Ltd
dspace.entity.typePublication
relation.isDepartmentOfPublication7709ae3c-a680-4cfb-ab82-a8f238a4dbee
relation.isDepartmentOfPublication.latestForDiscovery7709ae3c-a680-4cfb-ab82-a8f238a4dbee
relation.isOrgUnitOfPublication0bc7c43e-b5b0-4350-9d05-74d892acf9d1
relation.isOrgUnitOfPublication.latestForDiscovery0bc7c43e-b5b0-4350-9d05-74d892acf9d1
unesp.author.lattes7157327220048138
unesp.campusUniversidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia, Sorocabapt
unesp.departmentEngenharia de Controle e Automação - ICTSpt

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