Publicação: Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films
dc.contributor.author | Fraga, M. A. | |
dc.contributor.author | Massi, M. | |
dc.contributor.author | Oliveira, I. C. | |
dc.contributor.author | Cruz, Nilson Cristino da [UNESP] | |
dc.contributor.author | Santos Filho, S. G. dos | |
dc.contributor.institution | Instituto Tecnológico de Aeronáutica (ITA) | |
dc.contributor.institution | Universidade Estadual Paulista (Unesp) | |
dc.contributor.institution | Universidade de São Paulo (USP) | |
dc.date.accessioned | 2014-05-20T15:32:14Z | |
dc.date.available | 2014-05-20T15:32:14Z | |
dc.date.issued | 2009-01-01 | |
dc.description.abstract | Amorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films. | en |
dc.description.affiliation | Plasmas and Processes Laboratory Technological Institute of Aeronautics | |
dc.description.affiliation | Plasma Laboratory UNESP, Sorocaba | |
dc.description.affiliation | University of São Paulo LSI EPUSP, São Paulo | |
dc.description.affiliationUnesp | UNESP, Departamento de Engenharia de Controle e Automação, Plasma Lab, Sorocaba, Brazil | |
dc.format.extent | 327-330 | |
dc.identifier | http://www.scientific.net/MSF.615-617.327 | |
dc.identifier.citation | Materials Science Forum, v. 615 617, p. 327-330. | |
dc.identifier.doi | 10.4028/www.scientific.net/MSF.615-617.327 | |
dc.identifier.issn | 0255-5476 | |
dc.identifier.lattes | 7157327220048138 | |
dc.identifier.scopus | 2-s2.0-79251649240 | |
dc.identifier.uri | http://hdl.handle.net/11449/130388 | |
dc.identifier.wos | WOS:000265961100078 | |
dc.language.iso | eng | |
dc.publisher | Trans Tech Publications Ltd | |
dc.relation.ispartof | Materials Science Forum | |
dc.relation.ispartofsjr | 0,180 | |
dc.rights.accessRights | Acesso aberto | |
dc.source | Scopus | |
dc.subject | Silicon carbon nitride | en |
dc.subject | Thermal annealing | en |
dc.subject | Resistivity | en |
dc.subject | Elastic modulus | en |
dc.subject | Hardness | en |
dc.title | Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films | en |
dc.type | Trabalho apresentado em evento | pt |
dcterms.license | http://www.ttp.net/Downloads.html | |
dcterms.rightsHolder | Trans Tech Publications Ltd | |
dspace.entity.type | Publication | |
unesp.author.lattes | 7157327220048138 | |
unesp.campus | Universidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia, Sorocaba | pt |
unesp.department | Engenharia de Controle e Automação - ICTS | pt |