Design and Fabrication of a Wideband 8-Element Series-Feed Array on Metallic-Nanowire-Membrane Interposer for Millimeter Wave Frequency
| dc.contributor.author | Darweesh, Nawar [UNESP] | |
| dc.contributor.author | Bernardo, Helton | |
| dc.contributor.author | Ribeiro, Raul O. [UNESP] | |
| dc.contributor.author | Aldaya, Ivan [UNESP] | |
| dc.contributor.author | Santos, Renan A. | |
| dc.contributor.author | Da Rosa, Guilherme S. [UNESP] | |
| dc.contributor.author | Rehder, Gustavo P. | |
| dc.contributor.author | Serrano, Ariana L. C. | |
| dc.contributor.author | Penchel, Rafael A. [UNESP] | |
| dc.contributor.institution | Universidade Estadual Paulista (UNESP) | |
| dc.contributor.institution | TIMA | |
| dc.contributor.institution | Universidade Federal de Uberlândia (UFU) | |
| dc.contributor.institution | Universidade de São Paulo (USP) | |
| dc.date.accessioned | 2025-04-29T20:07:33Z | |
| dc.date.issued | 2024-01-01 | |
| dc.description.abstract | The purpose of this work is to present an 8-element wideband series-fed array antenna fabricated on a metallic-nanowire-membrane (MnM) interposer for 60 GHz millimeter-wave applications. The MnM interposer, based on nanoporous technology filled with copper, serves as an novel substrate with high potential for 3D integrated circuits due to the ease of creating through-substrate vias (TSV) and interconnections between microwave components and system-on-chip (SoC). The results demonstrate a wideband frequency with adequate impedance matching of 19.48 GHz (simulated) and 23.80 GHz (measured). | en |
| dc.description.affiliation | São Paulo State University (UNESP) School of Engineering, SP | |
| dc.description.affiliation | Univ. Grenoble-Alpes (UGA) CNRS Institut National Polytechnique Grenoble Alpes (Grenoble INP) TIMA | |
| dc.description.affiliation | Campus of Patos de Minas Federal University of Uberlandia (UFU), MG | |
| dc.description.affiliation | School of Engineering Univ. of São Paulo (USP), SP | |
| dc.description.affiliationUnesp | São Paulo State University (UNESP) School of Engineering, SP | |
| dc.identifier | http://dx.doi.org/10.1109/LACAP63752.2024.10876302 | |
| dc.identifier.citation | LACAP 2024 - 1st Latin American Conference on Antennas and Propagation, Conference Proceedings. | |
| dc.identifier.doi | 10.1109/LACAP63752.2024.10876302 | |
| dc.identifier.scopus | 2-s2.0-86000020713 | |
| dc.identifier.uri | https://hdl.handle.net/11449/306887 | |
| dc.language.iso | eng | |
| dc.relation.ispartof | LACAP 2024 - 1st Latin American Conference on Antennas and Propagation, Conference Proceedings | |
| dc.source | Scopus | |
| dc.subject | 3D integration | |
| dc.subject | Millimeter-Wave (mmW) | |
| dc.subject | MnM interposer | |
| dc.subject | series-fed array antennas | |
| dc.title | Design and Fabrication of a Wideband 8-Element Series-Feed Array on Metallic-Nanowire-Membrane Interposer for Millimeter Wave Frequency | en |
| dc.type | Trabalho apresentado em evento | pt |
| dspace.entity.type | Publication |

