Homola, TomášPrysiazhnyi, Vadym [UNESP]Stupavská, Monika2022-04-282022-04-282015-01-01International Journal of Nanomanufacturing, v. 11, n. 5-6, p. 237-244, 2015.1746-94061746-9392http://hdl.handle.net/11449/220597In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces.237-244engDBDDiffuse plasmaNano-modificationSilicon waferSurface treatmentArtigo10.1504/IJNM.2015.0752262-s2.0-84962509800