Bianchi, E. C. [UNESP]Da Silva, E. J. [UNESP]Da Silva, C. E. [UNESP]De Aguiar, P. R. [UNESP]Valarelli, Ivan de D. [UNESP]Monici, R. D. [UNESP]2014-05-272014-05-272001-01-01Revista Brasileira de Ciencias Mecanicas/Journal of the Brazilian Society of Mechanical Sciences, v. 23, n. 1, p. 9-22, 2001.0100-7386http://hdl.handle.net/11449/66429The aim of this work is to evaluate the mechanism of stock removal and the ground surface quality of advanced ceramics machined by a surface grinding process using diamond grinding wheels. The analysis of the grinding performance was done regarding the cutting surface wear behavior of the grinding wheel for ceramic workpieces. The ground surface was evaluated using Scanning Electron Microscopy (SEM). As a result it can be said that the mechanism of material removal in the grinding of ceramic is largely one of brittle fracture. The increase of the hmax can reduce the tangential force required by the process. Although, it results in an increase in the surface damage, reducing the mechanical properties of the ground component.9-22engAdvanced ceramicsDiamond wheelGrindingSEMBrittle fractureDiamond cutting toolsGrinding (machining)Scanning electron microscopySurface propertiesWear of materialsGround surface qualityStock removalCeramic materialsArtigo10.1590/S0100-73862001000100002S0100-73862001000100002Acesso aberto2-s2.0-003506513710991520075749211455400309660081