Effect of tartrate content on aging and deposition condition of copper-tin electrodeposits from a non-cyanide acid bath
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Data
2002-08-01
Autores
Carlos, I. A.
Bidoia, E. D.
Pallone, EMJA
Almeida, MRH
Souza, CAC
Título da Revista
ISSN da Revista
Título de Volume
Editor
Elsevier B.V.
Resumo
The effect of the presence of tartrate additive on the chemical stability of a Cu-Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was observed that optimal galvanostatic deposition with or without tartrate occurs at approximately 11 mA cm(-2). However, in the presence of tartrate the deposition charge was lower, leading to lower energy consumption. SEM analysis showed that the tartrate added to the plating bath caused a marked change in the morphology of the Cu/Sn films obtained gal vanostatic ally. (C) 2002 Elsevier B.V. B.V. All rights reserved.
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electroplating, copper-tin alloy, tartrate
Como citar
Surface & Coatings Technology. Lausanne: Elsevier B.V. Sa, v. 157, n. 1, p. 14-18, 2002.