Evaluation of Electrical Properties of Lap Joints for BSCCO and YBCO Tapes

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dc.contributor.authorBaldan, Carlos Alberto [UNESP]
dc.contributor.authorOliveira, Ulisses R.
dc.contributor.authorShigue, Carlos Y.
dc.contributor.authorRuppert Filho, Ernesto
dc.contributor.institutionUniversidade de São Paulo (USP)
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)
dc.date.accessioned2014-05-20T13:27:26Z
dc.date.available2014-05-20T13:27:26Z
dc.date.issued2009-06-01
dc.description.abstractThe joint process between tapes of coated conductors is a critical issue for the most of the applications of high temperature superconductors (HTS). Using different fabrication techniques joints of YBCO coated superconductors were prepared and characterized through electrical measurements. For soldering material low melting point eutectic alloys, such as In-Sn (m.p. 116 degrees C) and Sn-Pb (m. p. 189 degrees C) were selected to prepare lap joints with effective length between 1 to 20 cm. The splice resistance and the critical current of the joints were evaluated by I-V curve measurements with the maximum current strength above the critical current, in order to evaluate the degree of degradation for each joint method. Pressed lap joints prepared with tapes without external reinforcement presented low resistance lap joint nevertheless some critical current degradation occurs when strong pressing is applied. When mechanical pressure is applied during the soldering process we can reduce the thickness of the solder alloy and a residual resistance arises from contributions of high resistivity matrix and external reinforcement. The lap joints for reinforced tape were prepared using two methods: the first, using as-supplied tape and the other after reinforcement-removal; in the latter case, the tapes were resoldered using Sn-Pb alloy. The results using several joint geometries, distinct surface preparation processes and different soldering materials are presented and analysed. The solder alloy with lower melting point and the longer joint length presented the smallest joint resistance.en
dc.description.affiliationUniv São Paulo, Escola Engn Lorena, Lorena, SP, Brazil
dc.description.affiliationUNESP, Dept Engn Eletr, Guaratingueta, SP, Brazil
dc.description.affiliationUniv Estadual Campinas, Fac Engn Eletr & Comp, Campinas, SP, Brazil
dc.description.affiliationUnespUNESP, Dept Engn Eletr, Guaratingueta, SP, Brazil
dc.description.sponsorshipCompanhia Paulista de Forca e Luz (CPFL)
dc.description.sponsorshipCoordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
dc.format.extent2831-2834
dc.identifierhttp://dx.doi.org/10.1109/TASC.2009.2017701
dc.identifier.citationIEEE Transactions on Applied Superconductivity. Piscataway: IEEE-Inst Electrical Electronics Engineers Inc, v. 19, n. 3, p. 2831-2834, 2009.
dc.identifier.doi10.1109/TASC.2009.2017701
dc.identifier.issn1051-8223
dc.identifier.lattes1689995854269032
dc.identifier.urihttp://hdl.handle.net/11449/9014
dc.identifier.wosWOS:000268282200071
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartofIEEE Transactions on Applied Superconductivity
dc.relation.ispartofjcr1.288
dc.relation.ispartofsjr0,408
dc.rights.accessRightsAcesso restrito
dc.sourceWeb of Science
dc.subjectCritical currenten
dc.subjectHTS tapesen
dc.subjectjoint lengthen
dc.subjectlow resistance lap jointen
dc.titleEvaluation of Electrical Properties of Lap Joints for BSCCO and YBCO Tapesen
dc.typeArtigo
dcterms.licensehttp://www.ieee.org/publications_standards/publications/rights/rights_policies.html
dcterms.rightsHolderIEEE-Inst Electrical Electronics Engineers Inc
unesp.author.lattes1689995854269032
unesp.campusUniversidade Estadual Paulista (Unesp), Faculdade de Engenharia, Guaratinguetápt

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