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Analysis of the influence of baffles and shields on the cooling of a digital transmission equipment

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dc.contributor.authorRamos, R. A V [UNESP]
dc.contributor.authorMilanez, L. F. [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-27T11:18:03Z
dc.date.available2014-05-27T11:18:03Z
dc.date.issued1996-01-01
dc.description.abstractIn this work design criteria for cooling of electronic systems used in a digital transmission equipment are considered. An experimental study using a simulated electronic equipment in which vertically oriented circuit boards are aligned to form vertical channels is carried out. Resistors are used to simulate actual components. The temperature of several components in the printed circuit boards are measured and the influence of the baffles and shields on the cooling effect are discussed. It was observed that the use of the baffles reduce the temperature levels and, the use of shields, although protecting the components from magnetic effects, cause an increase in the temperature levels.en
dc.description.affiliationDEM/FEIS-UNESP, Ilha Solteira-SP
dc.description.affiliationUnespDEM/FEIS-UNESP, Ilha Solteira-SP
dc.format.extent31-37
dc.identifierhttp://dx.doi.org/10.1109/ITHERM.1996.534542
dc.identifier.citationThermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, p. 31-37.
dc.identifier.doi10.1109/ITHERM.1996.534542
dc.identifier.lattes4582822311318387
dc.identifier.scopus2-s2.0-0029718030
dc.identifier.urihttp://hdl.handle.net/11449/130740
dc.identifier.wosWOS:A1996BG06B00004
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartofThermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
dc.rights.accessRightsAcesso aberto
dc.sourceScopus
dc.subjectCooling
dc.subjectDigital communication systems
dc.subjectElectronics packaging
dc.subjectHeat shielding
dc.subjectMagnetic field effects
dc.subjectThermal effects
dc.subjectDigital transmission equipment
dc.subjectPrinted circuit design
dc.titleAnalysis of the influence of baffles and shields on the cooling of a digital transmission equipmenten
dc.typeTrabalho apresentado em evento
dcterms.licensehttp://www.ieee.org/publications_standards/publications/rights/rights_policies.html
dcterms.rightsHolderI E E E
dspace.entity.typePublication
unesp.author.lattes4582822311318387
unesp.campusUniversidade Estadual Paulista (UNESP), Faculdade de Engenharia, Ilha Solteirapt
unesp.departmentEngenharia Mecânica - FEISpt

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Ilha Solteira - FEIS - Faculdade de Engenharia