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D-band transdirectional coupler employing an interdigital capacitor structure in 55-nm BiCMOS

dc.contributor.authorSimionato, Elígia
dc.contributor.authorSerrano, Ariana Lacorte Caniato
dc.contributor.authorRehder, Gustavo Pamplona
dc.contributor.authorRosa, Guilherme Simon da
dc.contributor.authorPenchel, Rafael Abrantes
dc.contributor.authorFerrari, Philippe
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)pt
dc.date.accessioned2026-08-12T17:04:42Z
dc.date.issued2026-02-03
dc.description.abstractThis work presents the first demonstration of a transdirectional (TRD) coupler operating at sub-THz frequencies. TRD couplers are particularly useful in active circuits due to their intrinsic DC blocking behavior, which is exclusive to this type of coupler. Despite the existence of techniques that enable high-frequency designs, no TRD coupler design has yet been demonstrated for frequencies above 30 GHz. This work therefore aims to demonstrate a TRD coupler operating within the D-band (110 GHz to 170 GHz), using an interdigital capacitor structure and considering a 55-nm BiCMOS technology. The proposed coupler's performance was verified through full-wave electromagnetic simulation and compared to other TRD designs from the literature. The proposed coupler occupies the smallest area and demonstrates comparable or superior performance across various parameters, with the exception of its quadrature behavior.en
dc.description.sponsorshipFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.description.sponsorshipOutra
dc.description.sponsorshipIdFAPESP: 2023/12921-5
dc.description.sponsorshipIdFAPESP: 2024/04045-3
dc.description.sponsorshipIdCNPq: 409146/2021-8
dc.description.sponsorshipIdCNPq: 444936/2024-6
dc.description.sponsorshipIdChips JU: 10109625
dc.description.versionVersão final do editor
dc.identifierhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11365701
dc.identifier.citationSIMIONATO, E. et al. D-band transdirectional coupler employing an interdigital capacitor structure in 55-nm BiCMOS. In: SBMO/IEEE MTT-S INTERNATIONAL MICROWAVE AND OPTOELECTRONICS CONFERENCE, 21., 2025, Campina Grande. Proceedings [...]. [S. l.]: IEEE, 2026. p. 801-805.
dc.identifier.doi10.1109/IMOC65414.2025.11365701
dc.identifier.isbn9798350392753
dc.identifier.lattes3109587808990012
dc.identifier.lattes7852266258511819
dc.identifier.lattes3412676669640264
dc.identifier.orcid0000-0002-5187-0618
dc.identifier.orcid0000-0001-6029-8337
dc.identifier.orcid0000-0002-7298-4518
dc.identifier.urihttps://hdl.handle.net/11449/329550
dc.language.isoeng
dc.publisherIEEE
dc.relation.ispartof2025 SBMO/IEEE MTT-S International Microwave and Optoelectronics Conference (IMOC)
dc.rights.accessRightsAcesso restritopt
dc.rights.sourceRightsclosed
dc.subjectCapacitadorespt
dc.subjectSimulação (Computadores)pt
dc.subjectCircuitos integradospt
dc.titleD-band transdirectional coupler employing an interdigital capacitor structure in 55-nm BiCMOSen
dc.title.alternativeAcoplador transdirecional na banda D utilizando uma estrutura de capacitor interdigital em tecnologia BiCMOS de 55 nmpt
dc.typeArtigopt
dspace.entity.typePublication
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relation.isAuthorOfPublication.latestForDiscovery73c3e35e-b4e6-4fa6-9bd4-de8a6701e28d
relation.isOrgUnitOfPublication72ed3d55-d59c-4320-9eee-197fc0095136
relation.isOrgUnitOfPublication.latestForDiscovery72ed3d55-d59c-4320-9eee-197fc0095136
unesp.campusUniversidade Estadual Paulista (UNESP), Faculdade de Engenharia, São João da Boa Vistapt

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