Nano-modification of Si-wafer surfaces using low-cost ambient air diffuse plasma
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Inderscience Publishers
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In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces.
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International Journal of Nanomanufacturing, v. 11, n. 5-6, p. 237-244, 2015.
