Logotipo do repositório
 

Publicação:
Characterization of PECVD a-C:H:Si:O:Cl films

dc.contributor.authorRossi, Diego [UNESP]
dc.contributor.authorLanders, Richard
dc.contributor.authorBortoleto, José R. R. [UNESP]
dc.contributor.authorDurrant, Steven F. [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)
dc.date.accessioned2018-12-11T17:32:16Z
dc.date.available2018-12-11T17:32:16Z
dc.date.issued2017-07-01
dc.description.abstractThin films were produced by plasma enhanced chemical vapor deposition of tetramethylsilane, chloroform, and argon mixtures. The partial pressure of chloroform in the chamber feed, CCl, was varied from 0% to 40%. Amorphous hydrogenated carbon films also containing silicon, oxygen, and small amounts of chlorine, a-C:H:Si:O:Cl, were produced at deposition rates of up to about 220 nm min−1 (for a CCl of 40%). Transmission infrared analyses revealed the presence of OH groups in chlorinated films, along with, among others, CH, C=C, Si-CH, Si-CH2, and Si-O-Si groups. As revealed by energy dispersive x-ray spectroscopy, the films could be doped with chlorine to a maximum of about 3 at. %. Surface morphology and roughness were examined using scanning electron microscopy and atomic force microscopy. Tauc band gaps, calculated from transmission ultraviolet-visible near infrared spectra, tend to decrease from ∼3.4 eV for unchlorinated films to around 2.5 eV for those doped with chlorine.en
dc.description.affiliationLaboratório de Plasmas Tecnológicos Instituto de Ciência e Tecnologia de Sorocaba Universidade Estadual Paulista (UNESP)
dc.description.affiliationGrupo de Física de Superfícies Instituto de Física Gleb Wataghin Universidade Estadual de Campinas
dc.description.affiliationUnespLaboratório de Plasmas Tecnológicos Instituto de Ciência e Tecnologia de Sorocaba Universidade Estadual Paulista (UNESP)
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.identifierhttp://dx.doi.org/10.1116/1.4982711
dc.identifier.citationJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, v. 35, n. 4, 2017.
dc.identifier.doi10.1116/1.4982711
dc.identifier.issn1520-8559
dc.identifier.issn0734-2101
dc.identifier.scopus2-s2.0-85018433274
dc.identifier.urihttp://hdl.handle.net/11449/178828
dc.language.isoeng
dc.relation.ispartofJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
dc.relation.ispartofsjr0,520
dc.rights.accessRightsAcesso restrito
dc.sourceScopus
dc.titleCharacterization of PECVD a-C:H:Si:O:Cl filmsen
dc.typeArtigo
dspace.entity.typePublication
unesp.campusUniversidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia, Sorocabapt
unesp.departmentEngenharia de Controle e Automação - ICTSpt

Arquivos