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Effect of tartrate content on aging and deposition condition of copper-tin electrodeposits from a non-cyanide acid bath

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dc.contributor.authorCarlos, I. A.
dc.contributor.authorBidoia, E. D.
dc.contributor.authorPallone, EMJA
dc.contributor.authorAlmeida, MRH
dc.contributor.authorSouza, CAC
dc.contributor.institutionUniversidade Federal de São Carlos (UFSCar)
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-20T13:56:06Z
dc.date.available2014-05-20T13:56:06Z
dc.date.issued2002-08-01
dc.description.abstractThe effect of the presence of tartrate additive on the chemical stability of a Cu-Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was observed that optimal galvanostatic deposition with or without tartrate occurs at approximately 11 mA cm(-2). However, in the presence of tartrate the deposition charge was lower, leading to lower energy consumption. SEM analysis showed that the tartrate added to the plating bath caused a marked change in the morphology of the Cu/Sn films obtained gal vanostatic ally. (C) 2002 Elsevier B.V. B.V. All rights reserved.en
dc.description.affiliationUniv Fed Sao Carlos, Dept Quim, BR-13560 Sao Carlos, SP, Brazil
dc.description.affiliationUNESP, Dept Bioquim & Microbiol, Rio Claro, SP, Brazil
dc.description.affiliationUniv Fed Sao Carlos, Dept Mat Engn, BR-13560 Sao Carlos, SP, Brazil
dc.description.affiliationUnespUNESP, Dept Bioquim & Microbiol, Rio Claro, SP, Brazil
dc.format.extent14-18
dc.identifierhttp://dx.doi.org/10.1016/S0257-8972(02)00139-1
dc.identifier.citationSurface & Coatings Technology. Lausanne: Elsevier B.V. Sa, v. 157, n. 1, p. 14-18, 2002.
dc.identifier.doi10.1016/S0257-8972(02)00139-1
dc.identifier.issn0257-8972
dc.identifier.lattes9220348583560043
dc.identifier.orcid0000-0001-7040-1983
dc.identifier.urihttp://hdl.handle.net/11449/20067
dc.identifier.wosWOS:000176940100003
dc.language.isoeng
dc.publisherElsevier B.V.
dc.relation.ispartofSurface & Coatings Technology
dc.relation.ispartofjcr2.906
dc.relation.ispartofsjr0,928
dc.rights.accessRightsAcesso restrito
dc.sourceWeb of Science
dc.subjectelectroplatingpt
dc.subjectcopper-tin alloypt
dc.subjecttartratept
dc.titleEffect of tartrate content on aging and deposition condition of copper-tin electrodeposits from a non-cyanide acid bathen
dc.typeArtigo
dcterms.licensehttp://www.elsevier.com/about/open-access/open-access-policies/article-posting-policy
dcterms.rightsHolderElsevier B.V.
dspace.entity.typePublication
unesp.author.lattes9220348583560043[2]
unesp.author.orcid0000-0002-6727-0545[3]
unesp.author.orcid0000-0001-7040-1983[2]
unesp.campusUniversidade Estadual Paulista (UNESP), Instituto de Biociências, Rio Claropt
unesp.departmentBioquímica e Microbiologia - IBpt

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Rio Claro - IB - Instituto de Biociências