Evaluation of bond strength in customizing fiber post using translucent resins photoactivated by different light‑emitting diodes

Abstract

Aims: The objective of the study was to evaluate two translucent resin composite systems for customizing light‑polymerized fiber posts with light‑emitting diode (LED) curing units regarding adhesion using conventional cement at 24 h and 6 months. Settings and Design: This was an experimental in vitro study. Methods: Forty roots were prepared and divided into four groups (n = 10): ZV‑Z350 resin and LED Valo; ZR‑Z350 resin and LED Radii‑Cal; OV‑Opallis resin and LED Valo; and OR‑Opallis resin and LED Radii‑Cal. The fiber post was customized and cemented with conventional resin cement and was photoactivated by two different sources. Statistical Analysis Used: The data were subjected to two‑way ANOVA and Tukey’s post hoc tests (P = 0.05). The data regarding the pattern of adhesive failures were described in terms of the frequency of occurrence in each third of the postspace. Results: Both at 24 h and 6 months, bond strength among groups was similar, regardless of the analyzed postspace 3rd (P > 0.05). Adhesive failure Type 4 was the most frequent in all thirds. Conclusions: Customizing the fiber post with Z350 and Opallis has the same effect on bond strength and adhesive failure pattern, regardless of the LED curing units used for photopolymerization.