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Impact of InxGa1-x composition and source Zn diffusion temperature on intrinsic voltage gain in InGaAs TFETs

dc.contributor.authorBordallo, C.
dc.contributor.authorMartino, J.
dc.contributor.authorAgopian, P. [UNESP]
dc.contributor.authorAlian, A.
dc.contributor.authorMols, Y.
dc.contributor.authorRooyackers, R.
dc.contributor.authorVandooren, A.
dc.contributor.authorVerhulst, A.
dc.contributor.authorSimoen, E.
dc.contributor.authorClaeys, C.
dc.contributor.authorCollaert, N.
dc.contributor.authorThean, A.
dc.contributor.authorIEEE
dc.contributor.institutionImec
dc.contributor.institutionUniversidade de São Paulo (USP)
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionKatholieke Univ Leuven
dc.date.accessioned2018-11-26T15:38:00Z
dc.date.available2018-11-26T15:38:00Z
dc.date.issued2016-01-01
dc.description.abstractThis work reports for the first time on the experimental study of the intrinsic voltage gain of InGaAs nTFET. The influence of Indium/Gallium composition and Zn diffusion temperature is analyzed. For a higher Indium amount (In0.7Ga0.3As compared to In0.53Ga0.47As) the band to band tunneling (BTBT) is improved due to bandgap narrowing. A higher Zn diffusion temperature gives rise to a higher source doping, resulting in a smaller tunneling length, which also increases BTBT. In both devices the intrinsic voltage gain is improved. One interesting characteristic of these devices is that they present good analog performance at low voltages (V-GS=V-DS=0.6V), which is promising for low power/low voltage analog applications. High-temperature operation increases in all cases more the output conductance than the transconductance, resulting in a lower intrinsic voltage gain.en
dc.description.affiliationImec, Leuven, Belgium
dc.description.affiliationUniv Sao Paulo, LSI PSI USP, Sao Paulo, Brazil
dc.description.affiliationUniv Estadual Paulista, UNESP, Campus Sao Joao da Boa Vista, Sao Paulo, Brazil
dc.description.affiliationKatholieke Univ Leuven, EE Dept, Leuven, Belgium
dc.description.affiliationUnespUniv Estadual Paulista, UNESP, Campus Sao Joao da Boa Vista, Sao Paulo, Brazil
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.description.sponsorshipFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.description.sponsorshipimec's Logic Device Program and its Core Partners
dc.format.extent3
dc.identifier.citation2016 Ieee Soi-3d-subthreshold Microelectronics Technology Unified Conference (s3s). New York: Ieee, 3 p., 2016.
dc.identifier.urihttp://hdl.handle.net/11449/159328
dc.identifier.wosWOS:000392693000023
dc.language.isoeng
dc.publisherIeee
dc.relation.ispartof2016 Ieee Soi-3d-subthreshold Microelectronics Technology Unified Conference (s3s)
dc.rights.accessRightsAcesso abertopt
dc.sourceWeb of Science
dc.subjectIII-V materials
dc.subjectAnalog
dc.subjectTFET
dc.subjectTemperature effects
dc.titleImpact of InxGa1-x composition and source Zn diffusion temperature on intrinsic voltage gain in InGaAs TFETsen
dc.typeTrabalho apresentado em eventopt
dcterms.licensehttp://www.ieee.org/publications_standards/publications/rights/rights_policies.html
dcterms.rightsHolderIeee
dspace.entity.typePublication
unesp.campusUniversidade Estadual Paulista (UNESP), Faculdade de Engenharia, São João da Boa Vistapt

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