Logotipo do repositório
 

Publicação:
Monitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedance

dc.contributor.authorFerreira, Fabio Isaac [UNESP]
dc.contributor.authorDe Aguiar, Paulo Roberto [UNESP]
dc.contributor.authorSilva, Rosemar Batista Da
dc.contributor.authorJackson, Mark James
dc.contributor.authorBaptista, Fabricio Guimaraes [UNESP]
dc.contributor.authorBianchi, Eduardo Carlos [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)
dc.contributor.institutionUniversidade Federal de Uberlândia (UFU)
dc.contributor.institutionSchool of Integrated Studies
dc.date.accessioned2023-03-02T00:08:59Z
dc.date.available2023-03-02T00:08:59Z
dc.date.issued2022-06-15
dc.description.abstractOne of the most promising monitoring techniques is based on electromechanical impedance (EMI) transducers, which are low-cost components and allow easy implementation. EMI signal features showed good results for some applications in previous studies, but it is still unexplored for machining processes, which is essential for metal-cutting industries. This paper presents a new approach to verify the applicability of EMI measurements to monitor surface quality after the plunge cylindrical grinding of non-flat parts, which require low roughness and tight dimensional tolerances. Tests were carried out in a camshaft grinder and two low-cost piezoelectric diaphragms were attached to each workpiece to guarantee redundancy. Roughness R a was also monitored to check existence of correlation with the EMI signals and relevant discussions regarding monitoring by EMI are presented. Results showed a great correlation between EMI measurement and surface roughness: 0.94 and 0.80 for both diaphragms. Since these diaphragms cost less than 1 US dollar and good correlation was verified, this monitoring system is promising to replace the traditional ones.en
dc.description.affiliationSão Paulo State University (UNESP) School of Engineering Electrical Engineering Department The Mechanical Engineering Department
dc.description.affiliationFederal University of Uberlândia Santa Mônica Campus School of Mechanical Engineering
dc.description.affiliationKansas State University School of Integrated Studies
dc.description.affiliationUnespSão Paulo State University (UNESP) School of Engineering Electrical Engineering Department The Mechanical Engineering Department
dc.format.extent12314-12322
dc.identifierhttp://dx.doi.org/10.1109/JSEN.2022.3172230
dc.identifier.citationIEEE Sensors Journal, v. 22, n. 12, p. 12314-12322, 2022.
dc.identifier.doi10.1109/JSEN.2022.3172230
dc.identifier.issn1558-1748
dc.identifier.issn1530-437X
dc.identifier.scopus2-s2.0-85129351648
dc.identifier.urihttp://hdl.handle.net/11449/241790
dc.language.isoeng
dc.relation.ispartofIEEE Sensors Journal
dc.sourceScopus
dc.subjectElectromechanical Impedance
dc.subjectPiezoelectric transducers
dc.subjectPlunge cylindrical grinding
dc.subjectStructural health monitoring
dc.subjectSurface roughness
dc.titleMonitoring of Cylindrical Plunge Grinding Process by Electromechanical Impedanceen
dc.typeArtigo
dspace.entity.typePublication
unesp.author.orcid0000-0002-0130-0975[1]
unesp.author.orcid0000-0002-9934-4465[2]
unesp.author.orcid0000-0001-5746-3020[3]
unesp.author.orcid0000-0002-1200-4354[5]
unesp.author.orcid0000-0003-2675-4276[6]
unesp.departmentEngenharia Mecânica - FEBpt

Arquivos