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Monitoring of 3-D Printing Defects Using the Electromechanical Impedance (EMI) Technique

dc.contributor.authorSoares, Cristiano [UNESP]
dc.contributor.authorFerreira, Fábio Isaac [UNESP]
dc.contributor.authorde Aguiar, Paulo Roberto [UNESP]
dc.contributor.authorKennerly, Victória Dutra [UNESP]
dc.date.accessioned2026-05-12T18:33:47Z
dc.date.issued2025-01-01
dc.description.abstractThe monitoring of manufacturing processes is essential to ensure the quality and structural integrity of the produced parts. However, several processes still require human intervention for defect detection, such as 3-D printing. This article investigates the potential of a monitoring system based on the electromechanical impedance (EMI) technique to identify defects in 3-D printed parts. A piezoelectric diaphragm was affixed to the print bed, and different printing conditions were used to manufacture the parts. The experimental results demonstrated that the EMI technique can infer defect areas by calculating the root mean square deviation (RMSD) index from the imaginary part of the impedance at a frequency range of (123.5–124.0) kHz. Notably, the diaphragm used in this study was obtained at a cost of less than U.S. ${\$}$ 1, and its performance exhibited a strong correlation. These observations suggest that the proposed system possesses considerable potential for effective monitoring of the 3-D printing process.
dc.description.affiliationDepartment of Electrical Engineering, São Paulo State University (UNESP), Bauru Campus, São Paulo, 17033-360, Brazil
dc.description.affiliationUnespDepartment of Electrical Engineering, São Paulo State University (UNESP), Bauru Campus, São Paulo, 17033-360, Brazil
dc.identifierhttps://app.dimensions.ai/details/publication/pub.1191258508
dc.identifier.dimensionspub.1191258508
dc.identifier.doi10.1109/tim.2025.3593579
dc.identifier.issn0018-9456
dc.identifier.issn1557-9662
dc.identifier.orcid0000-0002-2672-6497
dc.identifier.orcid0000-0002-0130-0975
dc.identifier.orcid0000-0002-9934-4465
dc.identifier.orcid0009-0004-8428-5927
dc.identifier.urihttps://hdl.handle.net/11449/323770
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartofIEEE Transactions on Instrumentation and Measurement; v. 74; p. 1-8
dc.rights.accessRightsAcesso restritopt
dc.rights.sourceRightsclosed
dc.sourceDimensions
dc.titleMonitoring of 3-D Printing Defects Using the Electromechanical Impedance (EMI) Technique
dc.typeArtigopt
dspace.entity.typePublication
relation.isOrgUnitOfPublication47f5cbd3-e1a4-4967-9c9f-2747e6720d28
relation.isOrgUnitOfPublication.latestForDiscovery47f5cbd3-e1a4-4967-9c9f-2747e6720d28
unesp.campusUniversidade Estadual Paulista (UNESP), Faculdade de Engenharia, Baurupt

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