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Publicação:
Relationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymers

dc.contributor.authorDias Filho, Newton Luiz [UNESP]
dc.contributor.authorDe Aquino, Hermes Adolfo [UNESP]
dc.contributor.authorPires, Geovanna [UNESP]
dc.contributor.authorCaetano, Laércio [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-27T11:21:53Z
dc.date.available2014-05-27T11:21:53Z
dc.date.issued2006-06-08
dc.description.abstractThe relationship between the dielectric properties (dielectric constant, ε′, and loss factor, ε; activation energy, E a) and the ratio of epoxy resin (OG) to hardener of the epoxy resin thermosetting polymers was investigated. The amplitude of the ε″ peak decreases with increasing OG content until about 73 wt.% and slightly increases at higher OG content. The temperature of the position of the ε″ peak increases with the increasing of OG content, reaching maximum values for compositions in the range of 67 and 73 wt.%, and then it decreases sharply at higher OG content. The activation energy obtained from dielectric relaxation increased with increasing wt.% OG up to around 70 wt.%. Further increase in concentration of OG up to 83 wt.% reduced E a. The curves of tensile modulus and fracture toughness mechanical properties as a function of OG content presented a similar behavior. ©2006 Sociedade Brasileira de Química.en
dc.description.affiliationDepartamento de Física e Química Universidade Estadual Paulista, Av. Brasil, 56 - Centro, CP 31, 15385-000 Ilha Solteira - SP
dc.description.affiliationUnespDepartamento de Física e Química Universidade Estadual Paulista, Av. Brasil, 56 - Centro, CP 31, 15385-000 Ilha Solteira - SP
dc.format.extent533-541
dc.identifierhttp://dx.doi.org/10.1590/S0103-50532006000300016
dc.identifier.citationJournal of the Brazilian Chemical Society, v. 17, n. 3, p. 533-541, 2006.
dc.identifier.doi10.1590/S0103-50532006000300016
dc.identifier.file2-s2.0-33744778706.pdf
dc.identifier.issn0103-5053
dc.identifier.lattes1509480515046572
dc.identifier.lattes2642875331083480
dc.identifier.scieloS0103-50532006000300016
dc.identifier.scopus2-s2.0-33744778706
dc.identifier.urihttp://hdl.handle.net/11449/68921
dc.identifier.wosWOS:000237738400016
dc.language.isoeng
dc.relation.ispartofJournal of the Brazilian Chemical Society
dc.relation.ispartofjcr1.444
dc.relation.ispartofsjr0,357
dc.rights.accessRightsAcesso aberto
dc.sourceScopus
dc.subjectDielectric analysis
dc.subjectDieletric relaxation
dc.subjectEpoxy resin
dc.subjectThermosetting materials
dc.titleRelationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymersen
dc.typeArtigo
dcterms.licensehttp://www.scielo.br/revistas/jbchs/iaboutj.htm
dspace.entity.typePublication
unesp.author.lattes1509480515046572
unesp.author.lattes2642875331083480
unesp.campusUniversidade Estadual Paulista (UNESP), Faculdade de Engenharia, Ilha Solteirapt
unesp.departmentFísica e Química - FEISpt

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