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Dielectric properties of bismuth niobate films using LaNiO3 bottom electrode

dc.contributor.authorGoncalves, L. F. [UNESP]
dc.contributor.authorRocha, L. S.R. [UNESP]
dc.contributor.authorSilva, C. C. [UNESP]
dc.contributor.authorCortés, J. A. [UNESP]
dc.contributor.authorRamirez, M. A. [UNESP]
dc.contributor.authorSimões, A. Z. [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2018-12-11T17:27:10Z
dc.date.available2018-12-11T17:27:10Z
dc.date.issued2016-03-01
dc.description.abstractBi3NbO7 (BNO) thin films were deposited on Pt/TiO2/SiO2/Si (100) and LaNiO3 bottom electrode substrates at room temperature from the polymeric precursor method. X-ray powder diffraction was used to investigate the formation characteristics and stability range of the tetragonal modification of a fluorite-type solid solution. The results showed that this tetragonal, commensurately modulated phase forms through the intermediate formation of the incommensurately modulated cubic fluorite phase followed by the incommensurate-commensurate transformation. LaNiO3 (LNO) bottom electrode strongly promotes the formation of high intensity (111) texture of BNO films. The dielectric constants of the films increased from 192 to 357 at 1 MHz with the bottom electrode while the leakage current behavior at room temperature of the films decreased from 10−7 to 10−8 A/cm2 at a voltage of 5 V. The reduction of dc leakage current is explained on the basis of relative phase stability and improved microstructure of the material. The capacitance density of 75 fC/µm2, dielectric loss of 0.04 % at 1 MHz, and breakdown strength of about 0.30 MV/cm is compatible with embedded decoupling capacitors applications.en
dc.description.affiliationUniv. Estadual Paulista- Unesp, Av. Dr Ariberto Pereira da Cunha 333, Portal das Colinas, P.O. Box 355
dc.description.affiliationUnespUniv. Estadual Paulista- Unesp, Av. Dr Ariberto Pereira da Cunha 333, Portal das Colinas, P.O. Box 355
dc.description.sponsorshipFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.description.sponsorshipIdFAPESP: 2013/07296-2
dc.description.sponsorshipIdCNPq: 573636/2008-7
dc.format.extent2866-2874
dc.identifierhttp://dx.doi.org/10.1007/s10854-015-4103-z
dc.identifier.citationJournal of Materials Science: Materials in Electronics, v. 27, n. 3, p. 2866-2874, 2016.
dc.identifier.doi10.1007/s10854-015-4103-z
dc.identifier.file2-s2.0-84957938937.pdf
dc.identifier.issn1573-482X
dc.identifier.issn0957-4522
dc.identifier.scopus2-s2.0-84957938937
dc.identifier.urihttp://hdl.handle.net/11449/177801
dc.language.isoeng
dc.relation.ispartofJournal of Materials Science: Materials in Electronics
dc.relation.ispartofsjr0,503
dc.rights.accessRightsAcesso aberto
dc.sourceScopus
dc.titleDielectric properties of bismuth niobate films using LaNiO3 bottom electrodeen
dc.typeArtigo
dspace.entity.typePublication
unesp.departmentMateriais e Tecnologia - FEGpt

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