Publicação: Dielectric properties of bismuth niobate films using LaNiO3 bottom electrode
dc.contributor.author | Goncalves, L. F. [UNESP] | |
dc.contributor.author | Rocha, L. S.R. [UNESP] | |
dc.contributor.author | Silva, C. C. [UNESP] | |
dc.contributor.author | Cortés, J. A. [UNESP] | |
dc.contributor.author | Ramirez, M. A. [UNESP] | |
dc.contributor.author | Simões, A. Z. [UNESP] | |
dc.contributor.institution | Universidade Estadual Paulista (Unesp) | |
dc.date.accessioned | 2018-12-11T17:27:10Z | |
dc.date.available | 2018-12-11T17:27:10Z | |
dc.date.issued | 2016-03-01 | |
dc.description.abstract | Bi3NbO7 (BNO) thin films were deposited on Pt/TiO2/SiO2/Si (100) and LaNiO3 bottom electrode substrates at room temperature from the polymeric precursor method. X-ray powder diffraction was used to investigate the formation characteristics and stability range of the tetragonal modification of a fluorite-type solid solution. The results showed that this tetragonal, commensurately modulated phase forms through the intermediate formation of the incommensurately modulated cubic fluorite phase followed by the incommensurate-commensurate transformation. LaNiO3 (LNO) bottom electrode strongly promotes the formation of high intensity (111) texture of BNO films. The dielectric constants of the films increased from 192 to 357 at 1 MHz with the bottom electrode while the leakage current behavior at room temperature of the films decreased from 10−7 to 10−8 A/cm2 at a voltage of 5 V. The reduction of dc leakage current is explained on the basis of relative phase stability and improved microstructure of the material. The capacitance density of 75 fC/µm2, dielectric loss of 0.04 % at 1 MHz, and breakdown strength of about 0.30 MV/cm is compatible with embedded decoupling capacitors applications. | en |
dc.description.affiliation | Univ. Estadual Paulista- Unesp, Av. Dr Ariberto Pereira da Cunha 333, Portal das Colinas, P.O. Box 355 | |
dc.description.affiliationUnesp | Univ. Estadual Paulista- Unesp, Av. Dr Ariberto Pereira da Cunha 333, Portal das Colinas, P.O. Box 355 | |
dc.description.sponsorship | Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP) | |
dc.description.sponsorship | Conselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq) | |
dc.description.sponsorshipId | FAPESP: 2013/07296-2 | |
dc.description.sponsorshipId | CNPq: 573636/2008-7 | |
dc.format.extent | 2866-2874 | |
dc.identifier | http://dx.doi.org/10.1007/s10854-015-4103-z | |
dc.identifier.citation | Journal of Materials Science: Materials in Electronics, v. 27, n. 3, p. 2866-2874, 2016. | |
dc.identifier.doi | 10.1007/s10854-015-4103-z | |
dc.identifier.file | 2-s2.0-84957938937.pdf | |
dc.identifier.issn | 1573-482X | |
dc.identifier.issn | 0957-4522 | |
dc.identifier.scopus | 2-s2.0-84957938937 | |
dc.identifier.uri | http://hdl.handle.net/11449/177801 | |
dc.language.iso | eng | |
dc.relation.ispartof | Journal of Materials Science: Materials in Electronics | |
dc.relation.ispartofsjr | 0,503 | |
dc.rights.accessRights | Acesso aberto | |
dc.source | Scopus | |
dc.title | Dielectric properties of bismuth niobate films using LaNiO3 bottom electrode | en |
dc.type | Artigo | |
dspace.entity.type | Publication | |
unesp.department | Materiais e Tecnologia - FEG | pt |
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