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dc.contributor.authorDa Silva, Wallace J.C.
dc.contributor.authorDa Silva, Marcelo R. [UNESP]
dc.contributor.authorTakashima, Keiko
dc.identifier.citationJournal of the Chilean Chemical Society, v. 60, n. 4, p. 2749-2751, 2015.
dc.description.abstractZinc oxide, an n-type semiconductor, has been used as photocatalyst for contaminated water purification by organic compounds. The addition of a p-type semiconductor as copper oxide could increase the catalytic efficiency through the p-n junction in order to decrease the electron-hole recombination. In this work, zinc and copper oxides containing 1.0, 3.0, and 5.0 % of copper were prepared by manual grinding, followed by heat treatment at 300C during 5 h. The zinc oxide and copper oxide mixture as well as their precursors were characterized by x-ray diffraction, diffuse reflectance, scanning electron microscopy, and x-ray fluorescence. The photocatalytic efficiency was verified by the direct red 80 tetraazodye decolorization using UV radiation under pseudo-first order conditions at natural pH (7.5-8.0) and 30 °C. The highest photocatalytic activity occurred to the semiconductor containing 1.0 % copper oxide, whose decolorization rate constant was equivalent to 6.40×10-2min-1, that is, 17.4 % larger in comparison to ZnO, 5.45×10-2min-1.en
dc.relation.ispartofJournal of the Chilean Chemical Society
dc.subjectCopper oxide
dc.subjectDirect red 80
dc.subjectHeterogeneous photocatalysis
dc.subjectZinc oxide
dc.titlePreparation and characterization of Zno/CuO semiconductor and photocatalytic activity on the decolorization of direct red 80 azodyeen
dc.contributor.institutionUniversidade Estadual de Londrina (UEL)
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)
dc.description.affiliationDepartamento de Química Laboratório de Processos de Oxidação Avançados Universidade Estadual de Londrina, caixa postal 10011
dc.description.affiliationFaculdade de Engenharia Colégio Técnico Industrial Universidade Estadual Paulista, caixa postal 473
dc.description.affiliationUnespFaculdade de Engenharia Colégio Técnico Industrial Universidade Estadual Paulista, caixa postal 473
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