Length of resin tags in pit-and-fissure sealants: all-in-one self-etching adhesive vs phosphoric acid etching.
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Data
2008-04-01
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Coorientador
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PURPOSE: To investigate the penetration (tags) of adhesive materials into enamel etched with phosphoric acid or treated with a self-etching adhesive, before application of a pit-and-fissure sealant. MATERIALS AND METHODS: The sample comprised six study groups with six specimens each. Before pit-and-fissure sealing with the materials Clinpro SealantTM (Groups I and II), Vitro Seal ALPHA (Groups III and IV) and Fuji II LC (Groups V and VI), the teeth in Groups I, III, and V were etched with 35% phosphoric acid for 30 seconds. Teeth in Groups II, IV, and VI received application of the self-etching adhesive Adper Prompt L-Pop. The treated teeth were sectioned buccolingually, ground to 100-microm thickness, decalcified, and analyzed by conventional light microscopy at 400x magnification. RESULTS: The teeth etched with phosphoric acid exhibited significantly greater penetration than specimens treated with self-etching adhesive. CLINICAL SIGNIFICANCE: When compared with enamel treated with a self-etching adhesive, the penetration (tags) of adhesive materials into enamel was greater when applied on enamel etched with phosphoric acid.
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biomedical and dental materials , Clinpro Sealant , compomer , dentin bonding agent , fissure sealant , Fuji glass ionomer lining cement , Fuji glass-ionomer lining cement , glass ionomer , phosphoric acid , Prompt L Pop , Prompt L-Pop , resin , resin cement , chemistry , comparative study , dental acid etching , dental bonding , enamel , human , materials testing , methodology , surface property , ultrastructure , Acid Etching, Dental , Compomers , Composite Resins , Dental Bonding , Dental Enamel , Dental Materials , Dentin-Bonding Agents , Glass Ionomer Cements , Humans , Materials Testing , Phosphoric Acids , Pit and Fissure Sealants , Resin Cements , Surface Properties
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Inglês
Como citar
Compendium of continuing education in dentistry (Jamesburg, N.J. : 1995), v. 29, n. 3, p. 186-192, 2008.