Temperature Dependence of AlGaN/GaN High Electron Mobility Transistors on 200 mm Si wafers

Nenhuma Miniatura disponível

Data

2022-01-01

Orientador

Coorientador

Pós-graduação

Curso de graduação

Título da Revista

ISSN da Revista

Título de Volume

Editor

Tipo

Trabalho apresentado em evento

Direito de acesso

Resumo

In this paper, the temperature dependence of AlGaN/GaN High Electron Mobility Transistors (HEMTs) on silicon substrates is studied experimentally. Drain current (ID), transconductance (gm), threshold voltage (VT) and drain-induced barrier lowering (DIBL) were analyzed in the temperature range from -35°C to 200°C. In addition, gate current (IG) and subthreshold slope (SS) were also analyzed in order to understand the physical mechanisms involved. The results indicate that gate current increases with increasing temperature. Also, as the gate current (IG) increases, the drain current (ID) decreases. The characteristics of AlGaN/GaN HEMTs on silicon substrates indicate that they may be a promising candidate for analog and radio frequency (RF) applications.

Descrição

Idioma

Inglês

Como citar

2022 IEEE Latin America Electron Devices Conference, LAEDC 2022.

Itens relacionados

Financiadores