Dielectric thermal analysis as a tool for quantitative-evaluation of the viscosity and the kinetics of epoxy resin cure

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dc.contributor.authorShigue, Carlos Y.
dc.contributor.authordos Santos, Rafaela G. S.
dc.contributor.authorde Abreu, Mariane M. S. P.
dc.contributor.authorBaldan, Carlos A.
dc.contributor.authorRobin, Alain L. M.
dc.contributor.authorRuppert-Filho, Ernesto
dc.contributor.institutionUniversidade de São Paulo (USP)
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionUniversidade Estadual de Campinas (UNICAMP)
dc.date.accessioned2014-05-20T15:27:55Z
dc.date.available2014-05-20T15:27:55Z
dc.date.issued2006-06-01
dc.description.abstractDielectric thermal analysis has been proved as a valuable tool for monitoring the epoxy curing process and the related rheological properties in the fabrication of polymer-matrix composite materials. This technique also has the potential to be applied in the monitoring of magnet impregnation processes as well as in quality control. In this work we present the quantitative evaluation of the viscosity changing and the curing kinetics for a commercial Stycast epoxy resin system at different temperatures through the impedance analysis. The results showed correlation between the real component of the complex impedance and the isothermal reaction extent. Comparing the dielectric analysis result with the viscosity measured by rotational rheometer we observed a similar behavior reported for dynamic mechanic analysis. The results comparison have shown that the kinetics parameters obtained from DSC and DETA analysis showed different sensitivities related to the characteristics of curing stages. We concluded that the dielectric thermal analysis should be applied in quantitative evaluation of cure kinetics.en
dc.description.affiliationFAENQUIL, Fac Engn Quim Lorena, Dept Mat Engn, DEMAR, Lorena, SP, Brazil
dc.description.affiliationUNESP, Fac Engn, Guaratingueta, SP, Brazil
dc.description.affiliationUniv Estadual Campinas, FEEC, Campinas, SP, Brazil
dc.description.affiliationUnespUNESP, Fac Engn, Guaratingueta, SP, Brazil
dc.format.extent1786-1789
dc.identifierhttp://dx.doi.org/10.1109/TASC.2005.869624
dc.identifier.citationIEEE Transactions on Applied Superconductivity. Piscataway: IEEE-Inst Electrical Electronics Engineers Inc., v. 16, n. 2, p. 1786-1789, 2006.
dc.identifier.doi10.1109/TASC.2005.869624
dc.identifier.issn1051-8223
dc.identifier.urihttp://hdl.handle.net/11449/37831
dc.identifier.wosWOS:000244804100417
dc.language.isoeng
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)
dc.relation.ispartofIEEE Transactions on Applied Superconductivity
dc.relation.ispartofjcr1.288
dc.relation.ispartofsjr0,408
dc.rights.accessRightsAcesso restrito
dc.sourceWeb of Science
dc.subjectcomplex impedancept
dc.subjectcuring extent degreept
dc.subjectepoxy curingpt
dc.subjectdielectric analysispt
dc.subjectthermal analysispt
dc.subjectviscositypt
dc.titleDielectric thermal analysis as a tool for quantitative-evaluation of the viscosity and the kinetics of epoxy resin cureen
dc.typeArtigo
dcterms.licensehttp://www.ieee.org/publications_standards/publications/rights/rights_policies.html
dcterms.rightsHolderIEEE-Inst Electrical Electronics Engineers Inc
unesp.author.orcid0000-0002-5818-1559[5]
unesp.author.orcid0000-0002-4327-0137[1]

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