DEA and DSC study of cubic silsesquioxane epoxy resin nanocomposites

Página do item simplificado
dc.contributor.authorFilho, Newton Luiz Dias [UNESP]
dc.contributor.authorDe Aquino, Hermes Adolfo [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)
dc.date.accessioned2022-04-28T20:07:42Z
dc.date.available2022-04-28T20:07:42Z
dc.date.issued2006-04-28
dc.description.abstractNon-isothermal dielectric analysis (DEA) and differential scanning calorimetry (DSC) techniques were used to study the epoxy nanocomposites prepared by reacting 1,3,5,7,9,11,13,15-octa[dimethylsiloxypropylglycidylether] pentaciclo [9.5.1.13,9.15'15.17,13] octasilsesquioxane (ODPG) with methylenedianiline (MDA). Loss factor (ε) and activation energy were calculated by DEA. The relationships between the loss factor, the activation energy, the structure of the network, and the mechanical properties were investigated. Activation energies determined by DEA and DSC, heat of polymerization, fracture toughness and tensile modulus show the same profile for mechanical properties with respect to ODPG content.en
dc.description.affiliationDepartamento de Física e Química UNESP-Universidade Estadual Paulista, Caixa Postal 31, 15385-000 Ilha Solteira- SP
dc.description.affiliationUnespDepartamento de Física e Química UNESP-Universidade Estadual Paulista, Caixa Postal 31, 15385-000 Ilha Solteira- SP
dc.format.extent1-18
dc.identifier.citationE-Polymers, p. 1-18.
dc.identifier.issn1618-7229
dc.identifier.scopus2-s2.0-33646360802
dc.identifier.urihttp://hdl.handle.net/11449/224749
dc.language.isoeng
dc.relation.ispartofE-Polymers
dc.sourceScopus
dc.titleDEA and DSC study of cubic silsesquioxane epoxy resin nanocompositesen
dc.typeArtigo
unesp.departmentFísica e Química - FEISpt

Arquivos

Coleções

Ilha Solteira - FEIS - Faculdade de Engenharia