Transfer Component Analysis for Compensation of Temperature Effects on the Impedance-Based Structural Health Monitoring

dc.contributor.authorSilva, Samuel da [UNESP]
dc.contributor.authorYano, Marcus Omori [UNESP]
dc.contributor.authorGonsalez-Bueno, Camila Gianini [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (UNESP)
dc.date.accessioned2022-04-28T19:41:26Z
dc.date.available2022-04-28T19:41:26Z
dc.date.issued2021-09-01
dc.description.abstractThe effects of temperature fluctuations in the impedance measurements’ spectral estimates confuse the procedures to distinguish actual states’ classification, demanding compensation. The present paper demonstrates a new method to achieve temperature compensation based on a Transfer Component Analysis (TCA), a subtype of transfer learning, of the features from a source domain (in a well-known labeled condition) to another target domain (in an unknown condition). This procedure assumes only the labeled features data in the healthy condition (baseline) and damaged state in a specific known temperature as source data. The features computed are the Root Mean Square Deviation (RMSD) indices of the real and imaginary impedance signals. A machine-learning algorithm based on Mahalanobis squared distance (D2) is trained using the features computed from the baseline condition in the reference temperature. Also, the other temperature and structural conditions data are assumed as testing data of the target condition. TCA’s main idea is mapping the features from the original features space to a new subspace where the detection becomes possible using the same training data in the source domain. The results performed in a testbench with a piezoelectric element (PZT) bonded under a set of temperatures monitored, and simulated damage confirmed that the proposed method could recognize the real states correctly by transferring the knowledge from the features of the source domain into the target domain, assuming different temperatures.en
dc.description.affiliationDepartment of Mechanical Engineering São Paulo State University (UNESP), Avenida Brasil 56
dc.description.affiliationUnespDepartment of Mechanical Engineering São Paulo State University (UNESP), Avenida Brasil 56
dc.description.sponsorshipConselho Nacional de Desenvolvimento Científico e Tecnológico (CNPq)
dc.description.sponsorshipCoordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
dc.description.sponsorshipIdCNPq: 306526/2019-0
dc.description.sponsorshipIdCAPES: 88882.433643/2019-01
dc.identifierhttp://dx.doi.org/10.1007/s10921-021-00794-6
dc.identifier.citationJournal of Nondestructive Evaluation, v. 40, n. 3, 2021.
dc.identifier.doi10.1007/s10921-021-00794-6
dc.identifier.issn1573-4862
dc.identifier.issn0195-9298
dc.identifier.scopus2-s2.0-85109590371
dc.identifier.urihttp://hdl.handle.net/11449/221928
dc.language.isoeng
dc.relation.ispartofJournal of Nondestructive Evaluation
dc.sourceScopus
dc.subjectDomain adaptation
dc.subjectElectromechanical impedance
dc.subjectTemperature effects
dc.subjectTransfer component analysis
dc.titleTransfer Component Analysis for Compensation of Temperature Effects on the Impedance-Based Structural Health Monitoringen
dc.typeArtigo
unesp.author.orcid0000-0001-6430-3746[1]
unesp.author.orcid0000-0002-9611-9692[2]

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