Tratamento a plasma para melhoria na metalização de placas de circuito impresso
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Data
2018-07-31
Autores
Laraia, André Bianchi
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Universidade Estadual Paulista (Unesp)
Resumo
Este trabalho apresenta o desenvolvimento de um processo de tratamento com plasma para melhorar ametalização química de placas de circuito impresso (PCI). A pluma de plasma é gerada em argônio a partir da descarga de barreira dielétrica (DBD) promovida entre uma agulha cirúrgica e um cilindro usando capilar de borosilicato como dielétrico. A tensão picoa-pico aplicada foi de 5 kV, com forma de onda senoidal na frequência de 37 kHz e potência de descarga em torno de 765 mW. O substrato é um composto de fibra de vidro e resina epóxi. Com incidência perpendicular da pluma de plasma na superfície, o diâmetro da área tratada circular é de 10 mm. Desta forma, o ângulo de contato reduz de 75 ° a 45 ° com 3 s de interação entre superfície da amostra e a ponta do plasma e o ângulo atinge o mínimo de 33 ° após 180 s de tempo de tratamento. A metalização química foi feita com banhos seqüenciais de solução de paládio e finalizada com banho de solução aquosa de cobre. Testes de adesão padrão mostraram uma forte adesão das camadas de metal nas superfícies previamente tratadas com as plumas de plasma. Esta adesão melhora com o tempo de tratamento. A melhoria na metalização foi observada em superfície plana e também em furos usados para conectar diferentes camadas em PCIs. A área metalizada na superfície dos buracos é maior nos orifícios tratados. Quanto maior o tempo de tratamento, maior é essa área. Todos os resultados indicaram que a técnica de tratamento por plasma de placas de fibra de vidro melhora a sua metalização química pelo cobre, levando a uma adesão mais uniforme e eficaz do metal à superfície com um método ambientalmente amigável
This work reports the development of a plasma treatment process to improve the chemical metallization of printed circuit boards (PCB). The plasma plume is generated in argon from a dielectric barrier discharge (DBD) promoted between a surgical needle and a cylinder using a borosilicate capillary as dielectric. The applied peak-to-peak voltage was 5 kV, with sinusoidal waveform at 37 kHz frequency and power in the discharge around 765 mW. The substrate was a composite of fiberglass and epoxy resin. With perpendicular incidence of the plasma plume on the surface the diameter of the circular treated area was 10 mm. In this area the contact angle reduces from 75° to 45° with 3 s of the plasma-surface interaction and the angle reaches the minimum of 33° after 180 s of treatment time. Chemical metallization was made with sequential baths of solution of palladium and finished with bath of aqueous solution of copper. Standard adhesion tests showed a strong adhesion of the metal layer on surfaces previously treated with the plasma plumes. This adhesion improves with the treatment time. The improvement in the metallization was observed on flat surface and also in holes used to connect different layers in PCB’s. The metallized area on the surface of the holes is larger in treated holes. The longer the treatment time the larger is this area. All these results indicated that the technique of plasma treatment of fiberglass boards improves its chemical metallization by copper leading to a more uniform and effective adhesion of the metal to the surface with an environmental friendly method
This work reports the development of a plasma treatment process to improve the chemical metallization of printed circuit boards (PCB). The plasma plume is generated in argon from a dielectric barrier discharge (DBD) promoted between a surgical needle and a cylinder using a borosilicate capillary as dielectric. The applied peak-to-peak voltage was 5 kV, with sinusoidal waveform at 37 kHz frequency and power in the discharge around 765 mW. The substrate was a composite of fiberglass and epoxy resin. With perpendicular incidence of the plasma plume on the surface the diameter of the circular treated area was 10 mm. In this area the contact angle reduces from 75° to 45° with 3 s of the plasma-surface interaction and the angle reaches the minimum of 33° after 180 s of treatment time. Chemical metallization was made with sequential baths of solution of palladium and finished with bath of aqueous solution of copper. Standard adhesion tests showed a strong adhesion of the metal layer on surfaces previously treated with the plasma plumes. This adhesion improves with the treatment time. The improvement in the metallization was observed on flat surface and also in holes used to connect different layers in PCB’s. The metallized area on the surface of the holes is larger in treated holes. The longer the treatment time the larger is this area. All these results indicated that the technique of plasma treatment of fiberglass boards improves its chemical metallization by copper leading to a more uniform and effective adhesion of the metal to the surface with an environmental friendly method
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Microdescargas, Jato de plasma atmosférico, Placa de circuito impresso, Tratamento superficial, Ambientalmente amigável, Microdischarges, Atmospheric plasma jet, Printed circuit board, Surface treatment, Environmental friendly, Raio, Metalização - Processos, Superfícies (Tecnologia)