The effect of chloride ions and A. ferrooxidans on the oxidative dissolution of the chalcopyrite evaluated by electrochemical noise analysis (ENA)
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Data
2009-12-28
Autores
Horta, D. G. [UNESP]
Acciari, H. A. [UNESP]
Bevilaqua, D. [UNESP]
Benedetti, Assis Vicente [UNESP]
Garcia, O. [UNESP]
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Resumo
It is believed that the dissolution of chalcopyrite (CuFeS2) in acid medium can be accelerated by the addition of Cl- ions, which modify the electrochemical reactions in the leaching system. Electrochemical noise analysis (ENA) was utilized to evaluate the effect of the Cl- ions and Acidithiobacillus ferrooxidans on the oxidative dissolution of a CPE-chalcopyrite (carbon paste electrode modified with chalcopyrite) in acid medium. The emphasis was on the analysis of the admittance plots (Ac) calculated by ENA. In general, a stable passive behavior was observed, mainly during the initial stages of CPE-chalcopyrite immersion, characterized by a low passive current and a low dispersion of the Ac plots, mainly after bacteria addition. This can be explained by the adhesion of bacterial cells on the CPE-chalcopyrite surface acting as a physical barrier. The greater dispersions in the Ac plots occurred immediately after the Cl- ions addition, in the absence of bacteria characterizing an active-state. In the presence of bacteria the addition of Clions only produced some effect after some time due to the barrier effect caused by bacteria adhesion. © (2009) Trans Tech Publications.
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Admittance, Bioleaching, Chalcopyrite, Electrochemical noise analysis, Acid medium, Acidithiobacillus ferrooxidans, Bacterial cells, Barrier effects, Carbon paste electrode, Chloride ions, Cl- ions, Electrochemical Noise Analysis, Electrochemical reactions, Ferrooxidans, Initial stages, Oxidative dissolution, Passive behavior, Physical barriers, Acids, Adhesion, Bacteriology, Cell adhesion, Chlorine compounds, Copper compounds, Dispersions, Dissolution, Electric network analysis, Ions, Surface chemistry, Metal recovery
Como citar
Advanced Materials Research, v. 71-73, p. 397-400.