Why silver deposition is so fast: Solving the enigma of metal deposition

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dc.contributor.authorPinto, Leandro M. C. [UNESP]
dc.contributor.authorSpohr, Eckhard
dc.contributor.authorQuaino, Paola
dc.contributor.authorSantos, Elizabeth
dc.contributor.authorSchmickler, Wolfgang
dc.contributor.institutionUlm University
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionLehrstuhl für Theoretische Chemie
dc.contributor.institutionUniversidad Nacional Del Litoral
dc.contributor.institutionUniversidad Nacional de Cõrdoba
dc.date.accessioned2014-05-27T11:29:58Z
dc.date.available2014-05-27T11:29:58Z
dc.date.issued2013-07-22
dc.description.abstractA perfect match: Silver deposition is one of the fastest electrochemical reactions, even though the Ag+ ion loses more than 5 eV solvation energy in the process. This phenomenon, an example of the enigma of metal deposition, was investigated by a combination of MD simulations, DFT, and specially developed theory. At the surface, the Ag+ ion experiences a strong interaction with the sp band of silver, which catalyzes the reaction. Copyright © 2013 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.en
dc.description.affiliationInstitute of Theoretical Chemistry Ulm University, 89069 Ulm
dc.description.affiliationFaculdade de Ciências Univ Estadual Paulista UNESP, 17.033-360 Bauru-SP
dc.description.affiliationUniversität Duisburg-Essen Lehrstuhl für Theoretische Chemie, 45134 Essen
dc.description.affiliationPRELINE Universidad Nacional Del Litoral, Santa Fe
dc.description.affiliationFaculdad de Matemática, Astronomía y Física IFEG-CONICET Universidad Nacional de Cõrdoba, Cõrdoba
dc.description.affiliationUnespFaculdade de Ciências Univ Estadual Paulista UNESP, 17.033-360 Bauru-SP
dc.description.sponsorshipDeutsche Forschungsgemeinschaft (DFG)
dc.description.sponsorshipIdDFG: Schm 344/34-1,2
dc.description.sponsorshipIdDFG: FOR 1376
dc.format.extent7883-7885
dc.identifierhttp://dx.doi.org/10.1002/anie.201301998
dc.identifier.citationAngewandte Chemie - International Edition, v. 52, n. 30, p. 7883-7885, 2013.
dc.identifier.doi10.1002/anie.201301998
dc.identifier.issn1433-7851
dc.identifier.issn1521-3773
dc.identifier.scopus2-s2.0-84880359340
dc.identifier.urihttp://hdl.handle.net/11449/76014
dc.identifier.wosWOS:000321896800057
dc.language.isoeng
dc.relation.ispartofAngewandte Chemie - International Edition
dc.relation.ispartofjcr12.102
dc.relation.ispartofsjr6,155
dc.relation.ispartofsjr6,155
dc.rights.accessRightsAcesso restrito
dc.sourceScopus
dc.subjectcorrosion
dc.subjectmetal deposition
dc.subjecttheoretical electrochemistry
dc.subjectElectrochemical reactions
dc.subjectMD simulation
dc.subjectMetal deposition
dc.subjectPerfect matches
dc.subjectSilver deposition
dc.subjectSolvation energy
dc.subjectStrong interaction
dc.subjectCatalysis
dc.subjectChemistry
dc.subjectCorrosion
dc.subjectDeposition
dc.titleWhy silver deposition is so fast: Solving the enigma of metal depositionen
dc.typeArtigo
dcterms.licensehttp://olabout.wiley.com/WileyCDA/Section/id-406071.html

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