Stress distribution around osseointegrated implants with different internal-cone connections: photoelastic and finite element analysis

dc.contributor.authorAnami, Lilian Costa [UNESP]
dc.contributor.authorCosta Lima, Julia Magalhaes da [UNESP]
dc.contributor.authorTakahashi, Fernando Eidi [UNESP]
dc.contributor.authorNeisser, Maximiliano Piero [UNESP]
dc.contributor.authorNoritomi, Pedro Yoshito
dc.contributor.authorBottino, Marco Antonio [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionCtr Tecnol Informacao Renato Archer
dc.date.accessioned2015-10-21T13:15:39Z
dc.date.available2015-10-21T13:15:39Z
dc.date.issued2015-04-01
dc.description.abstractThe goal of this study was to evaluate the distribution of stresses generated around implants with different internal-cone abutments by photoelastic (PA) and finite element analysis (FEA). For FEA, implant and abutments with different internal-cone connections (H- hexagonal and S- solid) were scanned, 3D meshes were modeled and objects were loaded with computer software. Trabecular and cortical bones and photoelastic resin blocks were simulated. The PA was performed with photoelastic resin blocks where implants were included and different abutments were bolted. Specimens were observed in the circular polariscope with the application device attached, where loads were applied on same conditions as FEA. FEA images showed very similar stress distribution between two models with different abutments. Differences were observed between stress distribution in bone and resin blocks; PA images resembled those obtained on resin block FEA. PA images were also quantitatively analyzed by comparing the values assigned to fringes. It was observed that S abutment distributes loads more evenly to bone adjacent to an implant when compared to H abutment, for both analysis methods used. It was observed that the PA has generated very similar results to those obtained in FEA with the resin block.en
dc.description.affiliationUniversidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia (ICT), Grad Program Restorat Dent, Prosthet Dent Unit, São José dos Campos, SP, Brasil
dc.description.affiliationUniversidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia (ICT), Departamento de Materiais Odontológicos e Prótese, São José dos Campos, SP, Brasil
dc.description.affiliationCentro de Tecnologia da Informação Renato Archer, Campinas, SP, Brasil
dc.description.affiliationUnespUniversidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia (ICT), Grad Program Restorat Dent, Prosthet Dent Unit, São José dos Campos, SP, Brasil
dc.description.affiliationUnespUniversidade Estadual Paulista (UNESP), Instituto de Ciência e Tecnologia (ICT), Departamento de Materiais Odontológicos e Prótese, São José dos Campos, SP, Brasil
dc.description.affiliationUnespCentro de Tecnologia da Informação Renato Archer, Campinas, SP, Brasil
dc.description.sponsorshipCoordenação de Aperfeiçoamento de Pessoal de Nível Superior (CAPES)
dc.format.extent155-162
dc.identifierhttp://www.joionline.org/doi/10.1563/AAID-JOI-D-12-00260
dc.identifier.citationJournal Of Oral Implantology. Lawrence: Allen Press Inc, v. 41, n. 2, p. 155-162, 2015.
dc.identifier.doi10.1563/AAID-JOI-D-12-00260
dc.identifier.issn0160-6972
dc.identifier.lattes4831502268574281
dc.identifier.lattes9234456003563666
dc.identifier.urihttp://hdl.handle.net/11449/128921
dc.identifier.wosWOS:000353303000015
dc.language.isoeng
dc.publisherAllen Press Inc
dc.relation.ispartofJournal Of Oral Implantology
dc.relation.ispartofjcr1.212
dc.relation.ispartofsjr0,569
dc.rights.accessRightsAcesso restrito
dc.sourceWeb of Science
dc.subjectInternal-cone connectionsen
dc.subjectFinite element analysisen
dc.subjectPhotoelasticityen
dc.titleStress distribution around osseointegrated implants with different internal-cone connections: photoelastic and finite element analysisen
dc.typeArtigo
dcterms.rightsHolderAllen Press Inc
unesp.author.lattes4831502268574281
unesp.author.lattes9234456003563666
unesp.campusUniversidade Estadual Paulista (Unesp), Instituto de Ciência e Tecnologia, São José dos Campospt

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