SILVER DISSOLUTION ON COPPER-BASED ALLOYS

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dc.contributor.authorAdorno, A. T.
dc.contributor.authorBeatrice, CRS
dc.contributor.authorBenedetti, Assis Vicente [UNESP]
dc.contributor.authorCabot, P. L.
dc.contributor.institutionUNIV BARCELONA
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.date.accessioned2014-05-20T15:19:36Z
dc.date.available2014-05-20T15:19:36Z
dc.date.issued1993-01-15
dc.description.abstractElectrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium.en
dc.description.affiliationUNIV BARCELONA,FAC QUIM,DEPT QUIM FIS,E-08028 BARCELONA,SPAIN
dc.format.extent411-414
dc.identifierhttp://dx.doi.org/10.1007/BF00357818
dc.identifier.citationJournal of Materials Science. London: Chapman Hall Ltd, v. 28, n. 2, p. 411-414, 1993.
dc.identifier.doi10.1007/BF00357818
dc.identifier.issn0022-2461
dc.identifier.urihttp://hdl.handle.net/11449/31052
dc.identifier.wosWOS:A1993KM82300020
dc.language.isoeng
dc.publisherChapman Hall Ltd
dc.relation.ispartofJournal of Materials Science
dc.relation.ispartofjcr2.993
dc.relation.ispartofsjr0,807
dc.rights.accessRightsAcesso restrito
dc.sourceWeb of Science
dc.titleSILVER DISSOLUTION ON COPPER-BASED ALLOYSen
dc.typeArtigo
dcterms.licensehttp://www.springer.com/open+access/authors+rights
dcterms.rightsHolderChapman Hall Ltd
unesp.author.lattes1769008264876945[3]
unesp.author.orcid0000-0002-0243-6639[3]
unesp.campusUniversidade Estadual Paulista (Unesp), Instituto de Química, Araraquarapt
unesp.departmentFísico-Química - IQARpt

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