Thermal Annealing Influence on the Properties of Heterostructure Based on 2 at.%Eu Doped SnO2 and Cu1.8S

dc.contributor.authorLima, João V. M. [UNESP]
dc.contributor.authorBoratto, Miguel H. [UNESP]
dc.contributor.authordos Santos, Stevan B. O. [UNESP]
dc.contributor.authorScalvi, Luis V. A. [UNESP]
dc.contributor.institutionUniversidade Estadual Paulista (Unesp)
dc.contributor.institutionUniversidade Federal de Santa Catarina (UFSC)
dc.date.accessioned2019-10-06T15:18:49Z
dc.date.available2019-10-06T15:18:49Z
dc.date.issued2018-12-01
dc.description.abstractAiming at optoelectronic applications, a heterostructure based on Eu-doped tin oxide (SnO2) and copper sulfide (Cu2−xS) is built. SnO2 thin films doped with 2 at.% Eu were obtained by the sol–gel dip-coating and spin-coating techniques, whereas the Cu2−xS film was obtained by resistive evaporation. Samples were prepared using three distinct thermal annealing temperatures of the SnO2 bottom layer: 150°C, 250°C and 500°C. Transmittance and absorption spectra of the heterostructure shows high transparency in the visible to near infrared range (600–1800 nm), and considering the dominance of SnO2 on light absorption, it was possible to evaluate the sample indirect bandgap around 3.5 eV, independently of the thermal annealing temperature. Cyclic voltammetry and impedance spectroscopy, in conjunction with calculation of the hysteresis index, show that the heterostructure presents a behavior highly capacitive, and the higher annealing temperature leads to higher capacitance at low frequencies, similar to the observed qualitative behavior of supercapacitive devices. Besides, the sample with the SnO2 bottom layer annealed at 500°C yielded a higher current density.en
dc.description.affiliationDepartment of Physics – FC UNESP-São Paulo State University
dc.description.affiliationPost-graduate Program in Materials Science and Technology UNESP- POSMAT
dc.description.affiliationPost-Graduate Program in Physics Department of Physics Federal University of Santa Catarina (UFSC)
dc.description.affiliationUnespDepartment of Physics – FC UNESP-São Paulo State University
dc.description.affiliationUnespPost-graduate Program in Materials Science and Technology UNESP- POSMAT
dc.description.sponsorshipFundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)
dc.description.sponsorshipIdFAPESP: 2016/16423-6
dc.format.extent7463-7471
dc.identifierhttp://dx.doi.org/10.1007/s11664-018-6687-6
dc.identifier.citationJournal of Electronic Materials, v. 47, n. 12, p. 7463-7471, 2018.
dc.identifier.doi10.1007/s11664-018-6687-6
dc.identifier.issn0361-5235
dc.identifier.scopus2-s2.0-85053783026
dc.identifier.urihttp://hdl.handle.net/11449/186888
dc.language.isoeng
dc.relation.ispartofJournal of Electronic Materials
dc.rights.accessRightsAcesso aberto
dc.sourceScopus
dc.subjectcopper sulfide
dc.subjectheterostructure
dc.subjectresistive evaporation
dc.subjectsol–gel
dc.subjectTin oxide
dc.titleThermal Annealing Influence on the Properties of Heterostructure Based on 2 at.%Eu Doped SnO2 and Cu1.8Sen
dc.typeArtigo
unesp.author.orcid0000-0001-5762-6424[4]

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