Publicação: Stress Analysis in Platform-Switching Implants: A 3-Dimensional Finite Element Study
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Data
2012-10-01
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Coorientador
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Allen Press Inc
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The aim of this study was to evaluate the influence of the platform-switching technique on stress distribution in implant, abutment, and pen-implant tissues, through a 3-dimensional finite element study. Three 3-dimensional mandibular models were fabricated using the Solid Works 2006 and InVesalius software. Each model was composed of a bone block with one implant 10 mm long and of different diameters (3.75 and 5.00 mm). The UCLA abutments also ranged in diameter from 5.00 mm to 4.1 mm. After obtaining the geometries, the models were transferred to the software FEMAP 10.0 for pre- and postprocessing of finite elements to generate the mesh, loading, and boundary conditions. A total load of 200 N was applied in axial (0 degrees), oblique (45 degrees), and lateral (90) directions. The models were solved by the software NeiNastran 9.0 and transferred to the software FEMAP 10.0 to obtain the results that were visualized through von Mises and maximum principal stress maps. Model A (implants with 3.75 mm/abutment with 4.1 mm) exhibited the highest area of stress concentration with all loadings (axial, oblique, and lateral) for the implant and the abutment. All models presented the stress areas at the abutment level and at the implant/abutment interface. Models B (implant with 5.0 mm/abutment with 5.0 mm) and C (implant with 5.0 mm/abutment with 4.1 mm) presented minor areas of stress concentration and similar distribution pattern. For the cortical bone, low stress concentration was observed in the pen-implant region for models B and C in comparison to model A. The trabecular bone exhibited low stress that was well distributed in models B and C. Model A presented the highest stress concentration. Model B exhibited better stress distribution. There was no significant difference between the large-diameter implants (models B and C).
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Journal of Oral Implantology. Lawrence: Allen Press Inc, v. 38, n. 5, p. 587-594, 2012.
